IMAGE
advpub_2023001.jpg (523.73 kB)
DATASET
CSVdata_Fig5.csv (0.27 kB)
DOCUMENT
Description of the Data-prof Naito.pdf (152.46 kB)
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Data on Thermal Conductivity of Thermal Insulation Boards
dataset
posted on 2023-02-09, 06:20 authored by Makio NaitoMakio Naito, Takahiro Kozawa, Akira Kondo, C.C. HuangThe CSV file contains the data on the relationship between thermal conductivity of the fibrous fumed silica compacts and temperature in Fig. 5 of the manuscript. The specimens are (1) hydrophilic silica added, (2) hydrophobic silica added, and (3) after 400 ℃ heat treatment of the board (2).
Thermal conductivity (λ) is calculated using the following equation.
λ = αcρ (α: thermal diffusivity, c: specific heat, ρ: density)
- Instrument
Measurement system by cyclic heating method (Thermal diffusivity) ;
Drop calorimeter (Specific heat) - Measurement condition
Temperature: 100, 200, 300, 400, 600 ℃
Atmosphere: 1 atm, in air - Experimental condition
Compounding ratio : Fumed silica nanoparticle 60 mass%; SiC particle 20 mass%; Glass fiber 20 mass%. Pressure of uniaxial press: 2 Mpa
Funding
Formation of nanoporous layer on the particle surface by its self-reforming and the applications for advanced materials
Japan Society for the Promotion of Science
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