Data on Thermal Conductivity of Thermal Insulation Boards

The CSV file contains the data on the relationship between thermal conductivity of the fibrous fumed silica compacts and temperature in Fig. 5 of the manuscript. The specimens are (1) hydrophilic silica added, (2) hydrophobic silica added, and (3) after 400 ℃ heat treatment of the board (2).

Thermal conductivity (λ) is calculated using the following equation. 

λ = αcρ (α: thermal diffusivity, c: specific heat, ρ: density)

• Instrument
   Measurement system by cyclic heating method (Thermal diffusivity) ;
   Drop calorimeter  (Specific heat)
• Measurement condition
  Temperature: 100, 200, 300, 400, 600 ℃
  Atmosphere: 1 atm,  in air 
• Experimental condition
  Compounding ratio :  Fumed silica nanoparticle 60 mass%; SiC particle 20 mass%; Glass fiber 20 mass%.  Pressure of uniaxial press: 2 Mpa