Data on Thermal Conductivity of Thermal Insulation Boards

<p>The CSV file contains the data on the relationship between thermal conductivity of the fibrous fumed silica compacts and temperature in <strong>Fig. 5</strong> of the manuscript. The specimens are (1) hydrophilic silica added, (2) hydrophobic silica added, and (3) after 400 ℃ heat treatment of the board (2).</p> <p>Thermal conductivity (λ) is calculated using the following equation. </p> <p>λ = α<em>c</em>ρ (α: thermal diffusivity, <em>c</em>: specific heat, ρ: density)</p> <ul> <li>Instrument<br>  Measurement system by cyclic heating method (Thermal diffusivity) ;<br>  Drop calorimeter  (Specific heat)</li> <li>Measurement condition<br> Temperature: 100, 200, 300, 400, 600 ℃<br> Atmosphere: 1 atm,  in air </li> <li>Experimental condition<br> Compounding ratio :  Fumed silica nanoparticle 60 mass%; SiC particle 20 mass%; Glass fiber 20 mass%.  Pressure of uniaxial press: 2 Mpa  </li> </ul>